| (*)Upon completion of the course they will be able to
• understand principle and concepts related to thin film nucleation and growth. (k1, k2)
• discriminate between and suitably select vacuum chambers and pumps. (k2, k3)
• understand principles of thermal evaporation. (k2, k3, k4)
• use a laser for pulsed laser deposition. (k2, k3)
• understand principles of e-beam evaporation. (k2, k3)
• understand principles of sputtering. (k2, k3)
• apply principles of electrochemical thin film formation. (k1, k2, k3)
• understand principles of chemical vapor phase deposition. (k2, k3)
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(*)The course is divided into several parts with sections of theoretical background refreshing:
• crystal structure - Symmetry groups, quasicrystals, crystallography tuning, Maxwell-Boltzmann distribution
• surface interactions - adsorption – desorption, surface diffusion
• vacuum chambers and pumps - flange systems, types of pumps for low and high vacuum
• thermal evaporation - thermal evaporation sources, design, MBE, JVD
• pulsed laser deposition - design, film characteristics
• energy beams and plasma - electron beam evaporation, lithography
• sputtering - planar diode, DC sputtering
• electrochemical films - electrodeposition, electroless deposition
• chemical vapor deposition - basics of CVD - thermodynamics, Si deposition, reactions
• chemical vapor deposition - types of CVD - APCVD, LPCVD, MOCVD, special CVD
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