Upon completing the course, students will possess the following skills. They are able to
- explain and discuss basic concepts of MOSFET transistors, CMOS technology and scaling of transistors (k2/k3);
- explain how to apply various processing techniques for semiconductor device fabrication (k2/k3);
- describe and explain the properties of semiconductor materials relevant for microelectronic devices (k2/k3);
- describe and explain how to grow and fabricate high quality silicon wafers, control the doping level, fabricate MOSFET transistors, pattern silicon wafers using lithography and plasma processing, grow and deposit insulating, semiconductor and metal layers metal layers (k2/k3);
- describe and explain the process flow for silicon MOSFETs (k2/k3).
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During the course, students will acquire knowledge in the following areas and concepts of semiconductor technology:
- basic properties of semiconductors;
- structure and function of MOSFET transistors;
- CMOS technology;
- silicon growth and wafer fabrication;
- doping and diffusion;
- lithography, pattern transfer;
- wet chemical etching, plasma etching;
- oxidation, thin film deposition;
- Very Large-Scale Integration (VLSI) process and process flow.
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