Detailed information |
Original study plan |
Master's programme Mechanical Engineering 2023W |
Objectives |
Cyber-physical molding tools will play an important role in the digitalized and at the same time flexible and cost-efficient production of plastic components. This lecture will provide the essential basics for this and deepen them by means of selected case studies.
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Subject |
The following contents will be taught:
- Brief introduction to the most important processes for manufacturing semi-finished and finished parts from plastics (injection molding, extrusion, thermoforming, blow molding) and structure of the manufacturing cells.
- Basic design and operation of molding tools
- Definition of cyber-physical systems (CPS, CPPS)
- Unique identifiability of the forming tool
- Sensors to detect the environmental conditions (ambient temperature, humidity ...)
- Sensors to detect the internal operating condition (structure-borne sound, ultrasound, cavity pressure, thermocouples, infrared, ...)
- Typical setting and process data and their data structure
- Common measurement data acquisition systems
- Interfaces and communication standards in the manufacturing cell (EUROMAP 67, OPC 40079)
- Model predictive process and quality controllers in plastics processing
- Typical defect types and frequencies during component manufacture
- Important requirements for and interfaces to Data Science
- Selected case studies
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Criteria for evaluation |
Examination consisting of a written and an oral part.
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Methods |
Use of the learning management system moodle. Use of Flipped Classroom as a teaching method. Parts of the lecture content are made available in advance for self-study and provided with a formative knowledge check with the help of moodle. During the face-to-face lessons, the course content is actively deepened and discussed.
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Language |
English and French |
Changing subject? |
No |
Earlier variants |
They also cover the requirements of the curriculum (from - to) 481WVERIMTK22: KV Instrumented molding tools for digitized plastic component production (2022W-2023S)
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